Our strengths include:
¤ Lead-free components and processes (RoHS)
¤ Single and double-sided SMT assembly
¤ Chip scale packaging
¤ Micro BGA
¤ Flip chip on Flex
¤ 0201 and 0402 chips
¤ Wirebound ICs
¤ CCGAs I/O 625-1657
¤ CBGAs I/O 256-937
¤ Conformal coating and ESS testing
¤ Class 1, 2 and 3 capabilities
¤ Backdrilling and blind via formation
¤ Embedded passives
¤ ESD Controlled Environment

Design and Engineering

Representing the best talent in the industry, Acronics' engineering team provides seasoned engineering services to improve PCBAs and accelerate time-to-market. From conceptual design, new product introduction (NPI), and prototyping to material selection and purchasing, test development, and design improvement, Acronics offers our customers a complete set of "design for excellence" services.

Flexible Manufacturing

With our large manufacturing facility and state-of-the-art SMT machines, Acronics provides flexible manufacturing options that adapt to cost targets, delivery requirements and fluctuating demands in volume. Our manufacturing facilities are closely linked with engineering resources, providing a fast ramp from prototype to volume production. Our manufacturing services include:
¤ Automated final assembly
¤ BGA assembly, rework and reballing
¤ Pin through hole (PTH) assembly
¤ Optical modules, fiber management and splicing
¤ Exotic fiber splice combinations
¤ Large board sizes
¤ Board thicknesses from 0.025" to 0.150"
¤ 0.5-inch backplanes with active devices
¤ 12-mil pitch connectors/QFPs
¤ Press-fit connectors